reader, solve the challenges of sensor semiconductor packaging

Kez Ekim 24, 2021

View in browser

Forward to a Friend

Featured White Paper

Global trends in logistic sensor packaging

The sensor market is exploding and one of the key drivers is the logistics market where the most advanced sensor device development is taking place and, in tandem, the most pressing challenges in regard to semiconductor packaging. This article will present three mega trends, explore the use of robots, cobots and automation and their impact on sensors, as well as how to solve the challenges of sensor semiconductor packaging.

About Palomar Technologies, Inc.

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions.

This email was sent by GlobalSpec | 201 Fuller Road, Suite 202 Albany, NY, 12203-3621 - 800.261.2052.

© 2021 All rights reserved. Use of this Web site signifies your agreement to the terms and conditions.

To unsubscribe from future white paper emails, click here